Did you know that you can save the environment and significantly increase the productivity of your surface structuring process at the same time?

Laser Surface Structuring

Laser source for thin film processing with top hat energy distribution
© Teem Photonics
Laser source for thin film processing with top hat energy distribution

Modern products possess ever more surface features, which require modern high-tech tools in the manufacturing process. Laser technology is predestined for the creation of fine structures, due to its contactless, tool-free handling. Therefore, laser surface structuring, which spans from ablation and scribing to engraving, can be used in almost every industrial manufacturing process, e.g. automotive, cellphone and TV production, photovoltaics and even coin minting.

A major application area for laser surface structuring is the production of thin-film organic photovoltaics and organic LEDs (OLED). Utilizing laser technology instead of conventional production methods offers not just higher precision and flexibility but also a very eco-friendly production, because of lower energy demands and less consumption of chemicals.

Laser surface structuring can be applied in large-scale mass production as well as for small and medium batch sizes. Its cost-effectiveness and the advantage of creating individualized structures, give companies a very powerful tool at hand.

By megawatt pulses at picosecond duration a layer from a material surface is vaporized without any thermal effects on the remaining material. The effect can be increased by applying multiple, ultra-short pulsed laser beams, which allow a contact-free and micrometer-precise (1/1000000th of a meter) removal of material without damaging surrounding areas.

This innovative laser-based technology demands particular requirements on optical components and design methods. Especially, the realization of simultaneous processing of multiple workpieces is not yet state-of-the art, but LASHARE is working on this and more.


PARROT - Parallel multi-beam ablation of rotationally symmetric work pieces

TEETO - Compact sub nanosecond laser source for thin film processing

FCPS - Laser system for flexible CIGS photovoltaic scribing

FEMPAR - Deep engraving system for coining dies with femtosecond laser